Suitable to be used for application or process involving: Photolithographic, Photovoltaic, Wafer Process, Color TFT LCD, Glass Substrate, Recycling & Equipment Maintenance.

• Applicable to aluminium and copper (non-corrosive to Al & Cu) which are used for semiconductor device
• Extremely low etching rate for Aluminium & Copper
• High resolution fit to realize high-definition patterns on photoresist
• Wide development margin characteristics
• Low foaming, suitable for development device with no foaming trouble